Cooling system
CS/SSS/01L
Some devices used for geophysical data acquisition have a tendency to overheat.
Excessively high temperatures, negatively affect the quality and reliability of operation.
This problem, for the most part, applies to closed (portable versions of the devices) or passively cooled designs.
W czasie projektów, wielokrotnie mieliśmy problem z przegrzewaniem TPU (Topside Processing Unit) do sonaru bocznego holowanego (wersja przenośna „P”).
After thermographic imaging, a solution to the problem was found.
A very high heat emission was occurring through the inner cover. As it was not possible to modify the hardware ('rental equipment'), we decided to design a cooling system.
The following parameters apply to the design, adapted to the TPU SSS 'P' version:
Heat sink: 380x200x25mm, cross-section area 23.22cm2
Fans: 2x 120x120x38mm, 20W, 127.5m /h
Thermostat: 0 - 60 °C
Fuse: F 5x20mm 0.35A 250V
Power supply: 40W/0.2A; 50-60Hz, 220-240V, AC
The system is equipped with a thermostat (switch-on threshold can be set), a fuse and
a diode
indicating fan operation. In addition, a 3-position switch allows the desired operating mode
to be selected.
If you have additional questions, are interested in purchasing or would like to make modifications,
please contact contact@mwgfsurvey.com.
Each cooling system is made to individual specifications.